## ATS-04B-79-C3-R0: Technical Analysis The **ATS-04B-79-C3-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power semiconductors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Straight Fin | | **Attachment Method** | Push Pin (Plastic) with Compression Spring | | **Dimensions (L x W x H)** | 25.0 mm x 25.0 mm x 30.0 mm | | **Thermal Interface (TIM)** | T766 (Pre-applied) | | **Thermal Resistance** | 2.63 °C/W (at 200 LFM) | | **Flow Direction** | Vertical | --- ### 2. Electronic/Physical Components Although this is a passive component, its design incorporates specific "parts" that interact with electronic hardware: #### A. The Heat Sink Body (Straight Fin Design) * **Thermal Dissipation:** The straight fin geometry is optimized for high-density airflow environments. The 30mm height allows for significant surface area contact with air, effectively pulling heat away from the die of the component. * **Material:** The blue-anodized aluminum provides high thermal conductivity while offering corrosion resistance and electrical insulation for the surface. #### B. The Push Pin Mechanism * **Mounting:** Uses two plastic push pins that lock into pre-drilled holes on a Printed Circuit Board (PCB). * **Compression Spring:** The brass or steel spring ensures a precise, constant pressure between the heat sink and the electronic chip. This eliminates air gaps that cause thermal failure. #### C. Thermal Interface Material (TIM) * **T766:** This part comes with a pre-applied phase-change material. When the electronic component heats up, the T766 softens to fill microscopic imperfections in the surfaces, maximizing heat transfer. --- ### 3. Thermal Performance Metrics The efficiency of this part is measured by its **Thermal Resistance**, which varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 2.63 | | **400 (2.0 m/s)** | 1.90 | | **600 (3.0 m/s)** | 1.60 | --- ### 4. Typical Applications * **BGA (Ball Grid Array) Cooling:** Used for mid-sized processors. * **Telecom Hardware:** Cooling FPGA and ASIC chips in switches and routers. * **Embedded Systems:** Industrial PCs where mechanical shock and vibration resistance (provided by the push pins) are required.