The **ATS-04D-04-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Heat Sink Type** | Fine Pitch (Straight Fin) | | **Thermal Resistance** | 11.58 °C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Physical Design Details The "04-C2-R0" portion of the part number defines the physical configuration: * **Footprint (40x40mm):** A standard size compatible with many square-packaged integrated circuits. * **Height (20mm):** A medium-profile height that balances surface area for cooling with vertical clearance requirements in server or desktop chassis. * **Fin Pattern:** High-density straight fins designed to maximize surface area contact with moving air. * **C2 (Material/Finish):** Indicates the Blue Anodized finish, which provides corrosion resistance and increased emissivity for better radiant cooling. --- ### 3. Electronic Application & Mounting The electronic integration of this part focuses on the **pushPIN™** attachment system: 1. **Mechanical Stability:** Uses a flexible attachment system consisting of a brass or plastic pin and a stainless steel spring. This ensures constant pressure on the electronic component, preventing the heat sink from shifting during vibration or shipping. 2. **Thermal Interface:** It comes with **T766** pre-applied. In electronics, the Thermal Interface Material (TIM) is critical because it fills microscopic air gaps between the component die and the heat sink base, significantly reducing thermal impedance. 3. **Hole Pattern:** Requires specific PCB drill holes (usually 3.0mm to 4.7mm depending on the pin) at a pitch of **33.00mm** to secure the hardware. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 11.58 | | 300 | 1.5 | 3.64 | | 500 | 2.5 | 2.10 | | 700 | 3.5 | 1.58 | ---