The **ATS-04D-06-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine-Pitch (increases surface area) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (H)** | 25.00 mm | | **Thermal Resistance** | 2.50 °C/W (@ 100 LFM) | | **Finish** | Blue Anodized | | **Spring/Pin Type** | Brass / Stainless Steel | --- ### 2. Design Features * **Heat Pipe/Fin Geometry:** This model utilizes a "Fine-Pitch" vertical fin array. This design is optimized for environments where there is forced air cooling (fans), as it maximizes the surface area to volume ratio. * **PushPIN™ Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical fastener. It provides consistent pressure (7-10 lbs) against the component, ensuring an optimal thermal interface. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with high-performance T766 phase-change material or similar, ensuring there are no air gaps between the heat sink and the chip. --- ### 3. Application Use Cases This specific electronic part is commonly used in: 1. **Networking Hardware:** Cooling ASICs in switches and routers. 2. **Industrial PCs:** Thermal management for embedded processors. 3. **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators. --- ### 4. Thermal Performance Data *Thermal resistance is measured in °C/W (Degrees Celsius per Watt).* | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :---: | :---: | :---: | :---: | :---: | | **Thermal Resistance** | 2.50 | 1.63 | 1.35 | 1.19 | 1.09 |