The **ATS-04D-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table highlights the primary mechanical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 18.66°C/W @ 100 LFM (Linear Feet per Minute) | | **Dimensions (L x W x H)** | 25mm x 25mm x 25mm | | **Fin Pattern** | Fine Pitch (Cross-Cut) | | **Finish** | Blue Anodized | --- ### Key Components & Design Features #### 1. Push-Pin Attachment Mechanism The "04D" in the part number indicates a specific push-pin and spring assembly. * **Purpose:** Provides consistent pressure (preload) between the heat sink and the electronic component. * **Benefit:** This ensures maximum contact for the Thermal Interface Material (TIM) and simplifies installation on the PCB via pre-drilled holes. #### 2. Cross-Cut Fin Design The heat sink features a grid-like "Cross-Cut" pattern rather than straight fins. * **Airflow Versatility:** This design allows for effective cooling regardless of the direction of the airflow (omni-directional). * **Surface Area:** Increasing the surface area in a compact 25mm footprint allows for high heat dissipation in space-constrained environments. #### 3. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and increases surface emissivity (the ability to radiate heat). #### 4. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the part comes with **T766 phase change material** or a high-performance thermal pad pre-applied to the base. This eliminates the need for manual application of thermal paste. --- ### Typical Applications * **High-speed Networking:** Switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** MOSFETs and voltage regulators. * **Compact Electronics:** Small form factor (SFF) devices requiring vertical cooling.