The **ATS-04D-11-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body), Blue Anodized (Finish) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Thermal Resistance** | 18.78°C/W (at 100 LFM) | | **Flow Direction** | XC (Cross-cut) / High-Flow Fins | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Cross-Cut Fin Design (XC) The "XC" designation refers to the fin arrangement. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in cramped electronic enclosures where air may not flow in a perfectly linear path. #### B. Push Pin Attachment This part uses a spring-loaded push pin mechanism. In electronics, this is preferred over adhesive because: * **Constant Pressure:** It ensures the heat sink maintains firm contact with the die, improving heat transfer. * **Serviceability:** It can be removed and reattached during hardware maintenance or upgrades. * **PCB Safety:** The pins are designed to fit pre-drilled holes in the PCB, reducing mechanical stress on the chip itself. #### C. Thermal Interface Material (T766) The unit comes with **T766** pre-applied to the base. This is a phase-change or high-performance thermal grease that fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal impedance. --- ### 3. Applications This specific heat sink is typically found in: 1. **Network Switches/Routers:** Cooling ASICs and processors. 2. **Embedded Systems:** For industrial PCs where vertical clearance is limited (only 10mm high). 3. **Power Supplies:** Cooling MOSFETs or power regulators.