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  • ATS-04D-119-C2-R0

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    The **ATS-04D-119-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, and power modules. ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.68 °C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. Heat Sink Geometry * **Fin Style:** The "119" series typically features a **Fine Pitch** or **Cross-Cut** design. This increases the surface area for heat dissipation while maintaining low airflow resistance. * **Base Plate:** The bottom is precision-machined to ensure maximum contact with the electronic component (IC/Chipset). #### B. The pushPIN™ Attachment System Unlike adhesive tapes that can fail over time, this part uses a mechanical spring-loaded pin system: 1. **Compression Springs:** Provide precise pressure to the component, ensuring the Thermal Interface Material (TIM) fills all microscopic gaps. 2. **Brass/Plastic Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Performance The efficiency of this part is measured by its **Thermal Resistance**. Lower values indicate better cooling: * **At 100 LFM (Linear Feet per Minute):** 4.68 °C/W * **At 500 LFM:** 1.63 °C/W * *Interpretation:* As airflow increases (via fans), the cooling capacity improves significantly. --- ### 3. Part Number Decoder The part number follows a specific nomenclature used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04** | Attachment Series (pushPIN™) | | **D** | Material Code (Aluminum) | | **119** | Specific Geometry/Fin pattern | | **C2** | Thermal Interface Material (T766) and Finish | | **R0** | Revision status / RoHS Compliant | --- ### 4. Typical Applications * **Networking Gear:** Switches and routers where high-speed processors generate significant heat. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Cooling MOSFETs or voltage regulators in power supplies.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?
    • ⤷ Can the T766 thermal interface material be replaced with a different compound?
    • ⤷ How does the 'Blue Anodized' finish affect the thermal performance compared to a plain finish?