ATS-04D-119-C2-R0
AI

The **ATS-04D-119-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, and power modules.
### 1. Technical Specifications
The following table highlights the critical mechanical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 4.68 °C/W (at 100 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Component Breakdown
#### A. Heat Sink Geometry
* **Fin Style:** The "119" series typically features a **Fine Pitch** or **Cross-Cut** design. This increases the surface area for heat dissipation while maintaining low airflow resistance.
* **Base Plate:** The bottom is precision-machined to ensure maximum contact with the electronic component (IC/Chipset).
#### B. The pushPIN™ Attachment System
Unlike adhesive tapes that can fail over time, this part uses a mechanical spring-loaded pin system:
1. **Compression Springs:** Provide precise pressure to the component, ensuring the Thermal Interface Material (TIM) fills all microscopic gaps.
2. **Brass/Plastic Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB).
#### C. Thermal Performance
The efficiency of this part is measured by its **Thermal Resistance**. Lower values indicate better cooling:
* **At 100 LFM (Linear Feet per Minute):** 4.68 °C/W
* **At 500 LFM:** 1.63 °C/W
* *Interpretation:* As airflow increases (via fans), the cooling capacity improves significantly.
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### 3. Part Number Decoder
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **04** | Attachment Series (pushPIN™) |
| **D** | Material Code (Aluminum) |
| **119** | Specific Geometry/Fin pattern |
| **C2** | Thermal Interface Material (T766) and Finish |
| **R0** | Revision status / RoHS Compliant |
---
### 4. Typical Applications
* **Networking Gear:** Switches and routers where high-speed processors generate significant heat.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Electronics:** Cooling MOSFETs or voltage regulators in power supplies.
- ⤷
What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ Can the T766 thermal interface material be replaced with a different compound?
- ⤷ How does the 'Blue Anodized' finish affect the thermal performance compared to a plain finish?