The **ATS-04D-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the "pushPIN™" series manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Fin Type** | Fine-Pitch | | **Fin Pattern** | Straight | | **Material** | Aluminum (AL6063) | | **Thermal Resistance** | 9.48°C/W (at 100 LFM) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 10.00 mm | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Finish** | Blue Anodized | --- ### 2. Detailed Component Breakdown #### A. Thermal Performance This heat sink is designed for high-density electronic packaging. The **Fine-Pitch** fin design maximizes the surface area within a small 45mm x 45mm footprint. * **Low Airflow:** At 1.0 m/s (200 LFM), the thermal resistance drops significantly to approximately **5.04°C/W**. * **High Airflow:** Under forced convection (700 LFM), it reaches its peak efficiency at **2.42°C/W**. #### B. Mechanical Attachment (The "pushPIN™" System) The "R0" suffix refers to the specific attachment kit. This system replaces traditional adhesive tapes with a mechanical solution: * **Pre-assembled Spring:** Provides precise pressure (engagement force) to ensure optimal thermal interface material (TIM) contact. * **Push-Pins:** These pass through pre-drilled holes in the PCB, ensuring the heat sink remains secure even under high-vibration environments. #### C. Material and Finish * **AL6063 Aluminum:** Chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Finish:** This is not just aesthetic; anodizing increases the emissivity of the surface, slightly improving radiant heat transfer and providing corrosion resistance. --- ### 3. Applications This part is typically found in: 1. **Telecommunications:** Cooling high-speed processors or ASICs. 2. **Embedded Systems:** For industrial motherboards where vertical space is limited (10mm height). 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---