The **ATS-04D-14-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Table | Parameter | Detail | | :--- | :--- | | **Part Number** | ATS-04D-14-C2-R0 | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) with Spring | | **Dimension (L x W x H)** | 50.0mm x 50.0mm x 20.0mm | | **Thermal Resistance** | 9.97°C/W (at 200 LFM) | | **Fin Type** | High-density straight fin | --- ### 2. Key Features and Component Breakdown #### A. The Heat Sink Body * **Aluminum Construction:** Offers a lightweight balance between thermal conductivity and cost-effectiveness. * **Blue Anodizing:** This chemical treatment increases corrosion resistance and provides a slight improvement in surface emissivity, aiding radiative heat transfer. #### B. Mounting Hardware (Push Pins) The "C2" in the part number indicates the mounting hardware configuration: * **Brass Push Pins:** These are inserted through pre-drilled holes in the PCB. * **Compression Springs:** These ensure constant, uniform pressure between the heat sink and the electronic component, which is critical for maximizing thermal transfer. #### C. Thermal Interface Material (TIM) * The **R0** suffix typically denotes that the unit comes pre-applied with a thermal interface material (like a phase-change pad) or a specific adhesive. This fills microscopic air gaps between the component and the sink. --- ### 3. Performance Analysis The efficiency of this part depends heavily on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low) | 12.63 | | 200 (Medium) | 9.97 | | 400 (High) | 6.42 | --- ### 4. Common Applications * **Embedded Systems:** Industrial PCs and controllers. * **Networking Gear:** Cooling for ASICs in routers and switches. * **Power Electronics:** Voltage regulators and high-speed memory modules.