The **ATS-04D-147-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed specifically for cooling electronic components such as processors, FPGAs, and GPUs. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-04D-147-C3-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 3.96°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Base Material** | Aluminum | --- ## 2. Key Electronic & Physical Components ### A. The Heat Sink Body The body is constructed from extruded aluminum. The blue anodized finish is not just aesthetic; it increases **surface emissivity**, allowing for better heat radiation and providing corrosion resistance. ### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "C3" designation refers to a specific attachment kit. * **Springs:** Provides consistent pressure (Pre-assembled) to ensure optimal interface with the component. * **Nylon/Brass Pins:** Secure the heat sink to the PCB through pre-drilled holes. ### C. Thermal Interface Material (TIM) * **Material:** T766 (typically pre-applied). * **Function:** This is a phase-change or grease-like layer on the bottom of the heat sink that fills microscopic air gaps between the electronic component (CPU/Chip) and the aluminum base to maximize heat transfer. --- ## 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (Linear Feet per Minute - LFM) within the electronics enclosure. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 6.73 | | 200 (Unducted) | 3.96 | | 400 (Unducted) | 2.90 | | 600 (Unducted) | 2.47 | --- ## 4. Application in Circuits This part is commonly found in: 1. **Telecommunications:** Cooling signal processors. 2. **Embedded Systems:** For industrial PCs where space is limited (10mm height). 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.