The **ATS-04D-15-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Series** | pushPIN™ | High-performance thermal interface | | **Material** | Aluminum | Blue Anodized finish | | **Dimensions** | 50 x 50 x 25 mm | Large footprint for high-heat ICs | | **Attachment** | Push-Pin | Secure mechanical mounting | | **Thermal Resistance** | 0.98°C/W (at 200 LFM) | Lower is better for heat dissipation | | **Airflow Path** | Straight-Fin | Optimized for vertical or horizontal airflow | --- ### 2. Core Electronic/Thermal Function This part belongs to the **Passive Cooling** category of electronic components. Its primary functions include: * **Heat Dissipation:** It increases the surface area of a high-power semiconductor (like a CPU, FPGA, or Power MOSFET), allowing heat to transfer more efficiently into the surrounding air. * **Thermal Protection:** By maintaining a lower operating temperature, it prevents "thermal throttling" and extends the lifespan of sensitive electronic components. * **Interface Management:** Designed to be used with a **Thermal Interface Material (TIM)**, usually pre-applied to the base, to eliminate air gaps between the component and the sink. --- ### 3. Key Electronic Design Features * **Push-Pin Mounting:** Unlike adhesive-based sinks, this uses a spring-loaded push-pin mechanism. This provides **constant pressure**, ensuring optimal thermal contact even under mechanical vibration. * **Material Efficiency:** Made from 6063 aluminum, providing a balance between high thermal conductivity and low weight (important for PCB mechanical stress). * **Component Compatibility:** With a 50mm square base, it is specifically designed for large-package BGA (Ball Grid Array) components and high-density power modules. --- ### 4. Part Number Breakdown (Nomenclature) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04** | Series Identification | | **D** | Material/Fin configuration code | | **15** | Specific thermal performance profile | | **C2** | Thermal Interface Material (T766) / Color | | **R0** | RoHS Compliant / Revision code |