The **ATS-04D-150-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Fin Style** | Fine Pitch (Straight Fins) | | **Thermal Resistance** | ~4.82 °C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Core Components and Design This electronic cooling part consists of three primary elements: #### A. Heat Sink Body * **Material:** Extruded aluminum is used for its excellent thermal conductivity and lightweight properties. * **Surface Area:** The vertical fins are spaced to allow maximum airflow (forced convection) while maintaining a compact footprint (35mm x 35mm). * **Finish:** The blue anodized coating prevents corrosion and improves emissivity slightly. #### B. Mounting Mechanism (Push-Pin & Spring) * **Function:** It uses a brass or plastic push-pin with a stainless steel spring. * **Benefit:** This provides consistent pressure (load) on the component, ensuring the thermal interface material (TIM) fills all microscopic gaps between the chip and the heat sink. #### C. Thermal Interface Material (TIM) * **Pre-applied:** The part comes with **T766** phase-change material or grease pre-applied to the base. * **Role:** It eliminates air gaps between the component being cooled and the aluminum base, significantly lowering thermal resistance. --- ### 3. Usage Context The **ATS-04D-150-C2-R0** is typically used in: 1. **Telecommunications:** Cooling high-speed processors in switches or routers. 2. **Industrial PCs:** Maintaining stable temperatures for logic controllers. 3. **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling. ---