The **ATS-04D-151-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.37°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Spring Type** | ATS-PPS-04 | --- ### 2. Key Design Features * **Fin Profile (Fine Pitch):** The "151" designation refers to the specific fin pattern. It uses a **straight fin** design, which is optimal for systems with a defined airflow direction (unidirectional). * **Push-Pin Attachment:** Instead of messy adhesives or simple clips, it uses a mechanical push-pin system. This provides consistent pressure (TIM compression) and makes the heat sink "reworkable" (easy to remove and reinstall). * **Pre-Applied TIM:** These units typically come with high-performance **Phase Change Material (PCM)** or thermal interface tape pre-applied to the base, ensuring maximum heat transfer from the chip to the aluminum. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the exact configuration: 1. **ATS:** Advanced Thermal Solutions (Manufacturer). 2. **04:** Indicates the push-pin size or series. 3. **D:** Denotes the specific spring/pin material type. 4. **151:** The dimensional and fin geometry code. 5. **C1:** Refers to the thermal performance category/material (Aluminum). 6. **R0:** Revision code (Standard version). --- ### 4. Application Use-Cases This part is commonly found in: * **Telecommunications:** Cooling ASICs in routers and switches. * **Embedded Systems:** Industrial PCs where space (10mm height) is limited. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.