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  • ATS-04D-153-C2-R0

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    The **ATS-04D-153-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat-generating integrated circuits (ICs). --- ## 1. Technical Specifications The following table highlights the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Pattern** | Straight Fin | | **Thermal Resistance** | 4.05 °C/W (at 100 LFM) | | **Weight** | ~45 grams | --- ## 2. Key Components & Features ### A. PushPIN™ Attachment System This part uses a specialized attachment mechanism that replaces standard screws or adhesive tapes. It consists of: * **Plastic/Brass Push Pins:** These snap into pre-drilled holes on the PCB. * **Compression Springs:** These apply a precise amount of downward force to ensure consistent contact between the heat sink and the component. ### B. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **ATS-PPS-02** thermal grease. This eliminates the need for manual application of thermal paste, ensuring optimal heat transfer from the electronic chip to the aluminum fins. ### C. Straight Fin Design The fins are arranged in a straight-line pattern. This design is optimized for **forced-air cooling** (airflow from a fan) where air travels through the channels to dissipate heat into the environment. --- ## 3. Applications The ATS-04D-153-C2-R0 is commonly used in the following electronic environments: 1. **Telecommunications:** Networking switches and routers. 2. **Power Supplies:** High-density power modules. 3. **Embedded Systems:** Industrial PCs where space is limited but thermal management is critical. ---
    ✨ Follow-up Questions
    • ⤷ What are the alternative thermal interface materials available for the pushPIN series?
    • ⤷ How do I calculate the correct hole spacing on a PCB for this heat sink?
    • ⤷ What is the difference between the blue anodized finish and a black anodized finish in terms of thermal performance?