The **ATS-04D-155-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series, designed specifically for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the part: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 5.37°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Pressure Drop** | 0.13 in-H2O (at 200 LFM) | --- ### 2. Key Electronic Components & Materials The effectiveness of this part in an electronic circuit depends on its material properties and mounting hardware: * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal phase-change material or a high-performance tape. This ensures the air gaps between the hot component and the heat sink are filled to maximize heat transfer. * **Aluminum 6063:** The heat sink is extruded from this alloy, chosen for its excellent thermal conductivity and lightweight properties, preventing physical stress on the PCB. * **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from oxidation and provides a slight increase in surface emissivity, which aids in radiant cooling. * **Push-Pin Springs:** The R0 suffix indicates a specific spring tension. These springs provide consistent downward pressure (clamping force) on the electronic chip, which is critical for maintaining thermal contact under vibration or thermal expansion. --- ### 3. Application Use Cases This part is commonly found in the following electronic environments: 1. **Network Switches/Routers:** Cooling high-speed ASICs. 2. **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. 3. **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural Convection) | 9.37 | | 200 (Low Flow) | 5.37 | | 500 (High Flow) | 3.30 |