The **ATS-04D-166-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series designed for cooling electronic components such as processors, chipsets, and power modules. ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Thermal Resistance** | 12.12°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Spring Type** | Compression Spring | --- ### 2. Key Component Analysis #### A. The Heat Sink Body (Aluminum) The body is constructed from aluminum for its lightweight properties and high thermal conductivity. The **Blue Anodized** coating is not just aesthetic; it provides: * Increased surface emissivity for better radiation cooling. * Corrosion resistance and electrical insulation for the surface of the sink. #### B. The Attachment System (Push Pins & Springs) Instead of using messy adhesives or permanent solder, the **ATS-04D-166-C1-R0** uses a mechanical fastening system: * **Brass Push Pins:** These are durable and designed to fit into specific PCB hole patterns. * **Compression Springs:** These provide consistent downward pressure, ensuring that the Thermal Interface Material (TIM) stays in flush contact with the heat source, maximizing heat transfer. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. In electronics, the TIM fills the microscopic air gaps between the chip surface and the heat sink. T766 is a high-performance phase-change material that offers low thermal impedance. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the part moves heat away from the electronic component. The lower the number, the better the cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM (1.0 m/s) | 12.12 | | 400 LFM (2.0 m/s) | 8.27 | | 600 LFM (3.0 m/s) | 7.01 | --- ### 4. Common Applications This part is typically used in space-constrained electronic environments where reliable thermal management is critical: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where vibration might loosen adhesive-based sinks. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.