ATS-04D-17-C2-R0
AI

The **ATS-04D-17-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation from integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of the device:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 35.00mm x 35.00mm x 12.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Fin Type** | Straight Fin |
| **Thermal Resistance** | 15.44 °C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Electronic Features
#### A. Thermal Management
The primary purpose of this part is to conduct heat away from a semiconductor device (like a CPU, GPU, or FPGA) to the surrounding air. By reducing the junction temperature, it ensures:
* **Component Longevity:** Prevents thermal degradation of silicon.
* **Performance Stability:** Prevents "thermal throttling" where a chip slows down to cool off.
#### B. PushPIN™ Attachment System
Unlike adhesive-based heat sinks, this part uses a mechanical attachment system.
* **Spring-loaded bolts:** Provide consistent pressure across the interface.
* **Reliability:** Resistant to vibration and mechanical shock, making it suitable for industrial or automotive electronics.
#### C. Thermal Interface Material (TIM)
The unit comes pre-applied with **T766**. In electronics, the TIM is critical because it fills microscopic air gaps between the heat source and the heat sink, significantly increasing heat transfer efficiency.
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### 3. Thermal Performance Analysis
Thermal resistance varies based on airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 15.44 |
| 200 | 6.18 |
| 300 | 3.63 |
| 400 | 2.65 |
| 500 | 2.17 |
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### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **04:** Series number
* **D:** Pin configuration/Style
* **17:** Specific size/fin profile
* **C2:** Material/Finish (Blue Anodized Aluminum)
* **R0:** Revision/Packaging code
- ⤷What is the difference between T766 and other thermal interface materials?
- ⤷ How do I calculate if this heat sink is sufficient for a 10W processor?
- ⤷ Can the pushPIN attachment be reused if the component is replaced?