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  • ATS-04D-17-C2-R0

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    The **ATS-04D-17-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation from integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the device: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35.00mm x 35.00mm x 12.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 15.44 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Management The primary purpose of this part is to conduct heat away from a semiconductor device (like a CPU, GPU, or FPGA) to the surrounding air. By reducing the junction temperature, it ensures: * **Component Longevity:** Prevents thermal degradation of silicon. * **Performance Stability:** Prevents "thermal throttling" where a chip slows down to cool off. #### B. PushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical attachment system. * **Spring-loaded bolts:** Provide consistent pressure across the interface. * **Reliability:** Resistant to vibration and mechanical shock, making it suitable for industrial or automotive electronics. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. In electronics, the TIM is critical because it fills microscopic air gaps between the heat source and the heat sink, significantly increasing heat transfer efficiency. --- ### 3. Thermal Performance Analysis Thermal resistance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 15.44 | | 200 | 6.18 | | 300 | 3.63 | | 400 | 2.65 | | 500 | 2.17 | --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **04:** Series number * **D:** Pin configuration/Style * **17:** Specific size/fin profile * **C2:** Material/Finish (Blue Anodized Aluminum) * **R0:** Revision/Packaging code
    ✨ Follow-up Questions
    • ⤷What is the difference between T766 and other thermal interface materials?
    • ⤷ How do I calculate if this heat sink is sufficient for a 10W processor?
    • ⤷ Can the pushPIN attachment be reused if the component is replaced?