The **ATS-04D-172-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 30mm x 30mm x 15mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Resistance** | 5.76°C/W (@ 100 LFM) | --- ### 2. Key Components & Construction #### A. The Heat Sink Body * **XCUT Fin Pattern:** Unlike straight fins, the XCUT design features gaps in the fins that allow for multi-directional airflow. This is critical in cramped electronic enclosures where air may not flow in a single straight line. * **Material:** Made of high-grade aluminum for a balance between weight, thermal conductivity, and cost. * **Finish:** The blue anodized finish provides a layer of corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. #### B. The Attachment System (Push-Pin) This part utilizes a mechanical fastening system rather than thermal adhesive: 1. **Push-Pins:** Plastic pins that snap into pre-drilled holes (usually 3.0mm) on the Printed Circuit Board (PCB). 2. **Compression Springs:** These sit on the pins to provide a consistent downward force (pressure). This ensures the heat sink maintains firm contact with the electronic chip, which is vital for efficient heat transfer. #### C. Thermal Interface Material (TIM) * **Pre-Applied Material:** This model usually comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the chip surface and the heat sink base to lower thermal resistance. --- ### 3. Applications The ATS-04D-172-C2-R0 is typically used in the following electronic environments: * **Telecommunications:** Cooling small processors in routers and switches. * **Embedded Systems:** Industrial PCs where high vibration might occur (the push-pin is more secure than adhesive). * **Power Supplies:** Cooling voltage regulators or power transistors. ---