The **ATS-04D-174-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, and high-power semiconductors. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-04D-174-C2-R0 | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Body), Blue Anodized Finish | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Fin Type** | Fine Pitch (Grid Array) | | **Thermal Resistance** | ~4.02°C/W (Unducted Flow @ 100 LFM) | --- ### Key Components & Features #### 1. Heat Sink Body (Aluminum) The body is constructed from aluminum for high thermal conductivity and low weight. The **Blue Anodized** finish is not just aesthetic; it provides surface protection and slightly improves radiation heat transfer. #### 2. pushPIN™ Attachment System This part utilizes a specialized mounting system: * **Compression Springs:** Ensure consistent pressure on the component (TIM) for optimal heat transfer. * **Push-Pins:** These secure the heat sink to pre-drilled holes in the PCB, offering a more reliable connection than adhesive tapes. #### 3. Thermal Interface Material (TIM) The model typically comes with **T766** pre-applied. This is a high-performance thermal grease/pad that fills microscopic air gaps between the component and the heat sink base. #### 4. Fin Design (Fine Pitch) The "grid" or "pin fin" design allows for maximum surface area. This specific model is optimized for **forced air cooling** (fans), as the dense fin arrangement requires air pressure to move through the gaps effectively. --- ### Comparison: Thermal Performance | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.02 | | 300 (1.5 m/s) | 2.11 | | 500 (2.5 m/s) | 1.61 | --- ### Common Applications * **Embedded Systems:** Cooling microcontrollers or FPGAs. * **Networking:** Routers and switches where high-profile cooling is necessary in restricted footprints. * **Power Electronics:** Transistors and VRMs (Voltage Regulator Modules).