The **ATS-04D-175-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Thermal Performance Data Performance depends on the airflow (velocity) within the electronic enclosure. Thermal resistance ($\theta_{sa}$) is measured in °C/W (lower is better). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (Unducted) | 13.52 | | 400 (Unducted) | 7.53 | | 600 (Unducted) | 5.33 | --- ### 3. Structural Components The "Electronic Parts" of this assembly include: * **The Heat Sink Body:** A 35mm square aluminum block with high-density fins. The **XCUT** design allows for omnidirectional airflow, meaning it cools effectively regardless of which way the fans are blowing inside the chassis. * **Push-Pin Attachment:** This model uses a tool-free mounting system. The pins are designed to fit into 3.0mm holes on a Printed Circuit Board (PCB). * **Compression Springs:** Brass springs provide consistent downward pressure (clamping force) to ensure maximum contact between the heat sink and the component, compensating for vibration or thermal expansion. * **TIM (Thermal Interface Material):** The base is pre-coated with **T766**. This is a specialty material that fills microscopic air gaps between the component and the metal, significantly improving heat transfer. --- ### 4. Typical Applications This specific part is commonly found in: 1. **Networking Hardware:** Switches and routers where space is limited but heat density is high. 2. **Embedded Systems:** Industrial PCs or controllers. 3. **Power Electronics:** Voltage regulator modules (VRMs).