ATS-04D-189-C2-R0
AI

The **ATS-04D-189-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed for cooling electronic components that require efficient heat dissipation in constrained spaces.
---
### 1. Technical Specifications
The following table outlines the primary electronic and physical characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | maxiFLOW™ |
| **Type** | Top Mount Heat Sink |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 4.74°C/W (Unducted Flow @ 200 LFM) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height (H)** | 20mm |
---
### 2. Key Features and Component Design
#### A. Thermal Performance
The heat sink is designed to manage the thermal output of high-power electronic components like CPUs, GPUs, or FPGAs. The "C2" in the part number indicates the use of **T766 Phase Change Material (PCM)** as the Thermal Interface Material (TIM), which ensures optimal heat transfer between the component and the sink.
#### B. The pushPIN™ Attachment System
Instead of simple adhesive tape, this model uses a specialized mechanical attachment:
* **Compression Springs:** Provide precise pressure to the component, preventing damage while maintaining contact.
* **Plastic/Brass Push Pins:** Designed for quick installation into pre-drilled holes on the PCB.
#### C. Fin Geometry
The maxiFLOW™ design features a flared fin structure. This geometry increases the effective surface area for heat radiation and reduces pressure drop, allowing the sink to perform better in systems with lower airflow (LFM).
---
### 3. Application Use Cases
The ATS-04D-189-C2-R0 is typically found in the following electronic environments:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Supplies:** Cooling voltage regulators and power MOSFETs.
---
- ⤷
What are the benefits of using T766 Phase Change Material over standard thermal grease?
- ⤷ How does the 'flared fin' design compare to standard straight fin heat sinks?
- ⤷ Is this heat sink compatible with standard 45x45mm BGA packages?