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  • ATS-04D-189-C2-R0

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    The **ATS-04D-189-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed for cooling electronic components that require efficient heat dissipation in constrained spaces. --- ### 1. Technical Specifications The following table outlines the primary electronic and physical characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | maxiFLOW™ | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 4.74°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 20mm | --- ### 2. Key Features and Component Design #### A. Thermal Performance The heat sink is designed to manage the thermal output of high-power electronic components like CPUs, GPUs, or FPGAs. The "C2" in the part number indicates the use of **T766 Phase Change Material (PCM)** as the Thermal Interface Material (TIM), which ensures optimal heat transfer between the component and the sink. #### B. The pushPIN™ Attachment System Instead of simple adhesive tape, this model uses a specialized mechanical attachment: * **Compression Springs:** Provide precise pressure to the component, preventing damage while maintaining contact. * **Plastic/Brass Push Pins:** Designed for quick installation into pre-drilled holes on the PCB. #### C. Fin Geometry The maxiFLOW™ design features a flared fin structure. This geometry increases the effective surface area for heat radiation and reduces pressure drop, allowing the sink to perform better in systems with lower airflow (LFM). --- ### 3. Application Use Cases The ATS-04D-189-C2-R0 is typically found in the following electronic environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Supplies:** Cooling voltage regulators and power MOSFETs. ---
    ✨ Follow-up Questions
    • ⤷ What are the benefits of using T766 Phase Change Material over standard thermal grease?
    • ⤷ How does the 'flared fin' design compare to standard straight fin heat sinks?
    • ⤷ Is this heat sink compatible with standard 45x45mm BGA packages?