The **ATS-04D-20-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Spring-loaded) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Thermal Resistance** | 7.14°C/W (at 100 LFM) | | **Fin Type** | XCUT (Cross-cut) | --- ### Key Electronic Components & Design Features #### 1. The XCUT Fin Design Unlike standard straight-fin heat sinks, the XCUT design features a cross-cut pattern. In electronic cooling, this is critical because it creates a larger surface area and promotes turbulence in the airflow, which significantly increases the efficiency of heat transfer away from the semiconductor. #### 2. Push-pin Attachment System The "04D" in the part number indicates a specific push-pin and spring assembly. This is vital for electronic reliability: * **Constant Pressure:** The pre-assembled springs provide a consistent "clamping force" against the electronic chip. * **Vibration Resistance:** The spring-loaded nature prevents the heat sink from shifting or losing contact during mechanical shock or vibration. #### 3. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties, ensuring it doesn't put excessive mechanical strain on the PCB (Printed Circuit Board). * **Blue Anodized Finish:** While aesthetic, the anodization layer provides electrical insulation and corrosion resistance, preventing short circuits if the heat sink accidentally touches nearby traces. ### Thermal Performance Overview | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | 100 LFM (0.5 m/s) | 7.14 °C/W | | 300 LFM (1.5 m/s) | 2.15 °C/W | | 500 LFM (2.5 m/s) | 1.46 °C/W | --- ### Typical Applications * **Integrated Circuits (ICs):** Cooling FPGAs and ASICs. * **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators. * **Telecommunications:** Used in networking hardware like switches and routers where space is constrained but thermal density is high.