The **ATS-04D-200-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or high-power transistors on a PCB. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Thermal Resistance** | 9.78°C/W @ 100 LFM | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. The Heatsink (Extrusion) The body is made of high-grade aluminum. It uses a **cross-cut fin design**, which increases surface area and allows for "omni-directional" airflow. This means it can dissipate heat effectively regardless of the direction the cooling fan is blowing. #### B. The Attachment (Push-Pins & Springs) Instead of adhesive tape, this model uses **plastic push-pins** and **compression springs**: * **Reliability:** Provides consistent pressure on the component, improving heat transfer. * **Ease of Install:** Requires two holes in the PCB for the pins to "click" into place. #### C. Thermal Interface Material (TIM) The part comes with **T766** phase-change material pre-applied to the base. This fills the microscopic air gaps between the chip and the heatsink to ensure maximum thermal conductivity. --- ### 3. Part Number Decoder The model number contains specific identifiers used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04D** | Series / Fin Type | | **200** | Size/Length Reference | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Revision / Standard Packaging | --- ### 4. Typical Applications * **Network Switches:** Cooling ASICs or FPGAs. * **Industrial Computers:** General-purpose cooling for high-heat surface mount components. * **Power Supplies:** Cooling voltage regulators or power modules.