The **ATS-04D-202-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part number: | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 50mm x 50mm x 15mm | | **Thermal Resistance (Flowing)** | 1.48 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 6.83 °C/W | | **Attachment Material** | T766 (Thermal Interface Material) | --- ### 2. Key Features * **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures a precise and secure fit to the PCB. It simplifies assembly and ensures consistent pressure on the heat source. * **XC (Cross-Cut) Fin Design:** The fins are cut in a grid pattern (cross-cut), which allows for multi-directional airflow. This is ideal for systems where the direction of the cooling fan's air may vary. * **High Thermal Conductivity:** Made from high-grade aluminum with a blue anodized finish, which not only provides corrosion resistance but also improves radiant heat transfer. * **Pre-applied TIM:** The part comes with **T766** thermal interface material pre-applied to the base, reducing assembly time and ensuring optimal thermal contact with the chip. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code `ATS-04D-202-C2-R0`: 1. **ATS**: Advanced Thermal Solutions (Manufacturer). 2. **04**: Series or specific design revision. 3. **D**: Thermal resistance category. 4. **202**: Geometric profile and fin configuration identifier. 5. **C2**: Finish code (Blue Anodized). 6. **R0**: RoHS compliance status and revision level. --- ### 4. Applications This part is commonly used in high-density electronic environments such as: * **Network Switches/Routers:** Cooling processors and ASICs. * **Embedded Systems:** For industrial computers where airflow might be restricted. * **Power Supplies:** To dissipate heat from MOSFETs or voltage regulators.