The **ATS-04D-206-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass/Plastic) | | **Thermal Resistance** | 7.71°C/W (at 100 LFM) | | **Dimensions** | 54.00mm x 54.00mm x 25.00mm | | **Weight** | ~0.15 lbs (approx. 68g) | --- ### 2. Design Characteristics This heat sink utilizes a **Fine-Pitch** fin design to maximize surface area for heat exchange. * **Fins:** It typically features a straight-fin or cross-cut pattern depending on the specific revision, optimized for directional airflow. * **Thermal Interface Material (TIM):** The part usually comes with **T766** pre-applied. This is a high-performance thermal pad/paste that fills microscopic air gaps between the heat sink base and the electronic component. * **Attachment:** The "push-pin" system uses a compression spring to ensure even pressure across the chip, which is critical for consistent thermal conductivity. --- ### 3. Thermal Performance Comparison The effectiveness of the ATS-04D-206-C2-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 7.71 | | 300 | 1.5 | 3.39 | | 500 | 2.5 | 2.54 | | 700 | 3.5 | 2.13 | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Electronics:** Dissipating heat from high-wattage MOSFETs or IGBTs. * **Evaluation Boards:** Cooling FPGAs during the prototyping phase. ---