The **ATS-04D-209-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other PCB components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W)** | 70mm x 70mm | | **Height** | 10.00mm | | **Thermal Resistance** | 6.27°C/W @ (Unducted Flow) | | **Fin Style** | XCUT (Cross-cut) | --- ### 2. Design and Engineering Features #### A. Fin Geometry (XCUT) The "XCUT" design features a grid-like pattern of square pins/fins. This is engineered for **omni-directional airflow**, meaning the heat sink performs efficiently regardless of which direction the cooling air is blowing across the board. #### B. Attachment Mechanism It utilizes a **Push-Pin** system with a compression spring. This provides several electronic and mechanical benefits: * **Constant Pressure:** Ensures the thermal interface material (TIM) is evenly compressed between the chip and the heat sink. * **Vibration Resistance:** The spring-loaded nature prevents the heat sink from shifting during transport or industrial operation. * **Ease of Assembly:** Can be installed manually or via automated systems through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes with **T766** thermal phase-change material or a high-performance thermal pad pre-applied to the base, ensuring immediate heat transfer upon installation. --- ### 3. Application Use Cases This specific heat sink is used for large-footprint electronic components that generate moderate to high heat: * **FPGA & ASIC Cooling:** Ideal for high-gate-count chips in telecommunications. * **Processors:** Used in embedded systems and industrial PCs. * **Power Supplies:** Cooling MOSFET arrays or large voltage regulators. --- ### 4. Thermal Performance Comparison The effectiveness of this part varies based on the air velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.27 | | 400 (2.0 m/s) | 4.46 | | 600 (3.0 m/s) | 3.67 |