ATS-04D-22-C3-R0
AI

The **ATS-04D-22-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is designed for cooling electronic components, typically integrated circuits (ICs) like BGA (Ball Grid Array) chips, CPUs, or GPUs.
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### ## Technical Specifications
Below is a breakdown of the electronic and physical characteristics of this specific component:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-04D-22-C3-R0 |
| **Material** | Aluminum |
| **Finish** | Red Anodized |
| **Thermal Resistance** | 13.88°C/W (Unducted) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 54.00mm x 40.00mm x 12.70mm |
| **Pitch** | Fine Pitch |
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### ## Key Electronic & Thermal Properties
#### 1. Thermal Resistance
The value **13.88°C/W** indicates how efficiently the heat sink transfers heat from the component surface to the surrounding air. In a powered electronic circuit, this determines the maximum wattage the component can dissipate before hitting its thermal junction limit.
#### 2. Material and Finish
* **Aluminum:** Chosen for its high thermal conductivity and lightweight properties.
* **Red Anodized:** This is not just for aesthetics; the anodized layer provides electrical insulation (to prevent short circuits if it touches exposed traces) and increases surface emissivity, which slightly improves radiant cooling.
#### 3. PushPIN™ Attachment
The "C3" in the part number signifies a specific attachment kit. Unlike adhesive tapes, this uses a spring-loaded pin mechanism:
* **Constant Pressure:** Ensures the thermal interface material (TIM) is compressed evenly for maximum heat transfer.
* **Reliability:** Resistant to shock and vibration, making it suitable for industrial or automotive electronics.
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### ## Usage in Electronic Systems
This part is typically found in:
* **Network Switches/Routers:** Cooling high-speed processors.
* **Power Supplies:** Heat dissipation for MOSFETs or Rectifiers.
* **Embedded Systems:** Protecting SoCs from thermal throttling.
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- ⤷
What is the significance of the 'Fine Pitch' fin design in this model?
- ⤷ Which Thermal Interface Materials (TIM) are recommended for the ATS-04D series?
- ⤷ How do I calculate the maximum power dissipation for my chip using this heat sink?