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  • ATS-04D-22-C3-R0

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    The **ATS-04D-22-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is designed for cooling electronic components, typically integrated circuits (ICs) like BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ### ## Technical Specifications Below is a breakdown of the electronic and physical characteristics of this specific component: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-04D-22-C3-R0 | | **Material** | Aluminum | | **Finish** | Red Anodized | | **Thermal Resistance** | 13.88°C/W (Unducted) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 54.00mm x 40.00mm x 12.70mm | | **Pitch** | Fine Pitch | --- ### ## Key Electronic & Thermal Properties #### 1. Thermal Resistance The value **13.88°C/W** indicates how efficiently the heat sink transfers heat from the component surface to the surrounding air. In a powered electronic circuit, this determines the maximum wattage the component can dissipate before hitting its thermal junction limit. #### 2. Material and Finish * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Red Anodized:** This is not just for aesthetics; the anodized layer provides electrical insulation (to prevent short circuits if it touches exposed traces) and increases surface emissivity, which slightly improves radiant cooling. #### 3. PushPIN™ Attachment The "C3" in the part number signifies a specific attachment kit. Unlike adhesive tapes, this uses a spring-loaded pin mechanism: * **Constant Pressure:** Ensures the thermal interface material (TIM) is compressed evenly for maximum heat transfer. * **Reliability:** Resistant to shock and vibration, making it suitable for industrial or automotive electronics. --- ### ## Usage in Electronic Systems This part is typically found in: * **Network Switches/Routers:** Cooling high-speed processors. * **Power Supplies:** Heat dissipation for MOSFETs or Rectifiers. * **Embedded Systems:** Protecting SoCs from thermal throttling. ---
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'Fine Pitch' fin design in this model?
    • ⤷ Which Thermal Interface Materials (TIM) are recommended for the ATS-04D series?
    • ⤷ How do I calculate the maximum power dissipation for my chip using this heat sink?