The **ATS-04D-26-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. Technical Specifications This component is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or high-power transistors. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 14.20 °C/W (@ 100 LFM) | | **Thermal Resistance (Static)** | 2.02 °C/W | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 10.00mm | | **Fin Pitch** | Fine-Pitch | | **Fin Pattern** | Straight | --- ### 2. Physical Design & Mounting The part number indicates a specific configuration for electronic cooling: * **Low Profile:** At only 10mm high, it is designed for tight spaces in server racks or thin electronic enclosures. * **pushPIN™ Attachment:** It uses a brass or plastic pin and a high-performance compression spring. This ensures even pressure across the electronic component (TIM - Thermal Interface Material), which is critical for preventing "hot spots." * **Pre-Applied TIM:** These units typically come with a pre-applied **T766** thermal interface material, ensuring immediate "peel-and-stick" style thermal conductivity. --- ### 3. Thermal Performance (Cooling Efficiency) Thermal resistance is measured in Celsius per Watt (°C/W). Lower values indicate better heat dissipation. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 14.20 | 6.95 | 3.84 | 2.80 | 2.25 | --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions * **04:** Series/Push-pin style * **D:** Plastic attachment material * **26:** Specific fin geometry/size * **C2:** Material/Color (Blue Anodized Aluminum) * **R0:** RoHS compliant ---