The **ATS-04D-33-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount devices like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Thermal Resistance (Flow)** | 17.42°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.85°C/W (at high velocity) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions** | 35mm x 35mm x 20mm | --- ### 2. Key Electronic Features #### A. Heat Sink Profile (Cross-Cut) The "33" in the part number refers to a specific fin geometry. This model utilizes a **straight-fin or cross-cut design** which allows for multi-directional airflow. This is critical in tightly packed electronic enclosures where air direction might not be perfectly linear. #### B. Thermal Interface Material (TIM) The part comes pre-assembled with **T766 phase-change material**. * **Function:** It fills the microscopic air gaps between the electronic component (die) and the heat sink base. * **Benefit:** Increases heat transfer efficiency without requiring the manual application of thermal paste. #### C. Push-Pin Mounting System Instead of using adhesive tapes (which can fail under high heat), this part uses a **spring-loaded push-pin mechanism**: * **Engagement:** Provides consistent pressure across the component. * **Reliability:** Ensures the heat sink stays attached during physical shocks or vibrations. --- ### 3. Application Use-Case This part is typically found in: * **Telecommunications:** Cooling signal processors. * **Embedded Systems:** Industrial PCs where fan failure must be compensated for by passive cooling. * **Power Supplies:** Managing heat in voltage regulators. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04** | Form Factor/Size Category | | **D** | Material/Process Indicator | | **33** | Height and Fin Configuration | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code |