The **ATS-04D-36-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific naming convention that defines its physical and thermal characteristics. | Parameter | Specification | Details | | :--- | :--- | :--- | | **Dimensions** | 36.83 x 36.83 mm | The footprint area of the heat sink. | | **Height** | 15.00 mm | The vertical profile (low profile design). | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Finish** | Blue Anodized | Protects against corrosion and improves emissivity. | | **Attachment** | push-PIN™ | Mechanical mounting system for secure PCB attachment. | | **Thermal Resistance** | 14.82° C/W (at 1.0 m/s) | Efficiency of heat transfer at specific airflow. | --- ### 2. Key Features * **push-PIN™ Mounting:** It utilizes a flexible, spring-loaded push-pin mechanism. This ensures consistent pressure on the component (TIM - Thermal Interface Material) for optimal heat transfer and allows for easy installation. * **Cross-Cut Fin Design:** The fins are cut in a grid-like pattern. This design allows for multidirectional airflow, making it effective in systems where the direction of the cooling fan may vary. * **Pre-applied TIM:** Usually comes with a high-performance Thermal Interface Material (T766 or similar) on the base to reduce assembly time and ensure a clean contact surface. --- ### 3. Electronic Application This heat sink is typically used in the following scenarios: 1. **Embedded Systems:** Cooling small-form-factor processors. 2. **Telecommunications:** Dissipating heat from high-speed networking chips. 3. **Power Electronics:** Managing heat for Voltage Regulators (VRMs) or MOSFET arrays. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (m/s) | 0.5 (Natural) | 1.0 (Low) | 2.5 (High) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 14.82 | 7.70 | 4.45 | ---