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  • ATS-04D-54-C2-R0

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    The **ATS-04D-54-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Parameter | Specification | Description | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Leading brand in thermal management | | **Series** | pushPIN™ | Uses a push-pin attachment mechanism | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Protects against corrosion and improves radiation | | **Thermal Resistance** | 7.00°C/W (Unducted) | Measures heat dissipation efficiency | | **Dimensions** | 35mm x 35mm x 30mm | Length x Width x Height | | **Attachment Type** | Push-Pin | Spring-loaded plastic or brass pins | --- ### 2. Key Features * **High Performance Fin Design:** It typically utilizes a "fine pitch" or "cross-cut" fin pattern to maximize surface area for air contact. * **Push-Pin Mounting:** This ensures consistent pressure between the heat sink and the electronic component, which is critical for maximizing thermal transfer through the interface material. * **Pre-assembled:** Most parts in this series come with pre-drilled holes and pre-installed springs/pins for rapid assembly on a PCB (Printed Circuit Board). * **Thermal Interface Material (TIM):** It often comes with a pre-applied Phase Change Material or thermal tape to simplify the installation process. --- ### 3. Electronic Application This part is used in the following scenarios: 1. **Semiconductor Cooling:** Dissipating heat from BGA (Ball Grid Array) or LGA packages. 2. **Embedded Systems:** Used in industrial PCs where airflow may be restricted. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators in high-efficiency power supplies. --- ### 4. Part Number Breakdown The suffix codes provide details on the specific variant: * **54:** Refers to the specific fin geometry and spacing. * **C2:** Indicates the thermal performance category (Medium-High). * **R0:** Typically refers to the RoHS compliance status and revision version.
    ✨ Follow-up Questions
    • ⤷ What are the compatible mounting hole patterns for the ATS-04D-54-C2-R0?
    • ⤷ How does the 'C2' thermal rating compare to other series in the pushPIN family?
    • ⤷ Is this heat sink suitable for passive cooling
    • ⤷ or does it require an active fan?