ATS-04D-54-C2-R0
AI

The **ATS-04D-54-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics.
| Parameter | Specification | Description |
| :--- | :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions | Leading brand in thermal management |
| **Series** | pushPIN™ | Uses a push-pin attachment mechanism |
| **Material** | Aluminum | Lightweight with high thermal conductivity |
| **Finish** | Blue Anodized | Protects against corrosion and improves radiation |
| **Thermal Resistance** | 7.00°C/W (Unducted) | Measures heat dissipation efficiency |
| **Dimensions** | 35mm x 35mm x 30mm | Length x Width x Height |
| **Attachment Type** | Push-Pin | Spring-loaded plastic or brass pins |
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### 2. Key Features
* **High Performance Fin Design:** It typically utilizes a "fine pitch" or "cross-cut" fin pattern to maximize surface area for air contact.
* **Push-Pin Mounting:** This ensures consistent pressure between the heat sink and the electronic component, which is critical for maximizing thermal transfer through the interface material.
* **Pre-assembled:** Most parts in this series come with pre-drilled holes and pre-installed springs/pins for rapid assembly on a PCB (Printed Circuit Board).
* **Thermal Interface Material (TIM):** It often comes with a pre-applied Phase Change Material or thermal tape to simplify the installation process.
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### 3. Electronic Application
This part is used in the following scenarios:
1. **Semiconductor Cooling:** Dissipating heat from BGA (Ball Grid Array) or LGA packages.
2. **Embedded Systems:** Used in industrial PCs where airflow may be restricted.
3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators in high-efficiency power supplies.
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### 4. Part Number Breakdown
The suffix codes provide details on the specific variant:
* **54:** Refers to the specific fin geometry and spacing.
* **C2:** Indicates the thermal performance category (Medium-High).
* **R0:** Typically refers to the RoHS compliance status and revision version.
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What are the compatible mounting hole patterns for the ATS-04D-54-C2-R0?
- ⤷ How does the 'C2' thermal rating compare to other series in the pushPIN family?
- ⤷ Is this heat sink suitable for passive cooling
- ⤷ or does it require an active fan?