The **ATS-04D-56-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" series designed for efficient thermal management of electronic components. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 17.72°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Pin Material** | Brass | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This heat sink utilizes a **Cross-Cut (Pin Fin)** design, which provides several advantages for electronics: * **Omnidirectional Airflow:** Unlike straight-fin heat sinks, the cross-cut design allows air to enter from any direction, making it ideal for systems where the airflow path is unpredictable or turbulent. * **Low Profile:** With a height of 15mm, it is suitable for 1U server chassis or compact embedded systems. * **Push-Pin Mounting:** It uses a spring-loaded mechanism that ensures consistent pressure on the component (CPU, GPU, or ASIC), improving heat transfer and protecting the chip from mechanical shock. --- ### 3. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM) within the enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 17.72 | | 200 | 6.51 | | 300 | 4.46 | | 400 | 3.54 | | 500 | 3.02 | --- ### 4. Implementation Example To integrate this into a PCB design, you must account for the mounting hole diameter and the footprint: ```markdown PCB Layout Requirements: - Hole Diameter: 3.0mm (typically) - Hole Spacing: 33mm x 33mm (standard for 40mm push-pin series) - Keep-out Zone: 42mm x 42mm (to allow for pin clearance) ```