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  • ATS-04D-72-C3-R0

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    The **ATS-04D-72-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components. ### 1. Component Specifications The following table highlights the primary mechanical and thermal specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Thermal Resistance** | 5.19 °C/W (at 100 LFM) | | **Airflow Pattern** | Straight Fin | --- ### 2. Design and Functional Elements #### A. Thermal Performance The "C3" in the part number indicates a specific thermal profile. This heat sink is designed for **straight fin** airflow, which is ideal for systems with a clear, directional path for air to move across the component. The thermal resistance decreases significantly as airflow (LFM - Linear Feet per Minute) increases: * **Low Airflow (1.0 m/s):** High resistance. * **High Airflow (3.5 m/s):** Resistance drops to approximately 1.45 °C/W. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **ATS-04D-72-C3-R0** uses a mechanical attachment system consisting of: * **Push-pins:** Plastic or brass pins that lock into pre-drilled holes in the PCB. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the electronic component (CPU, GPU, or FPGA), maximizing heat transfer. #### C. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodize:** This is not just for aesthetics; the anodized coating increases surface emissivity, slightly improving radiative cooling and providing corrosion resistance. --- ### 3. Applications This specific heat sink is typically used for cooling: 1. **Application Specific Integrated Circuits (ASICs)** 2. **Field Programmable Gate Arrays (FPGAs)** 3. **Microprocessors** in telecommunications or industrial networking equipment. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the pushPIN system?
    • ⤷ How does 'Straight Fin' design compare to 'Cross-Cut' designs for thermal efficiency?
    • ⤷ Is a Thermal Interface Material (TIM) pre-applied to this part number?