ATS-04D-72-C3-R0
AI

The **ATS-04D-72-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components.
### 1. Component Specifications
The following table highlights the primary mechanical and thermal specifications:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 15mm |
| **Thermal Resistance** | 5.19 °C/W (at 100 LFM) |
| **Airflow Pattern** | Straight Fin |
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### 2. Design and Functional Elements
#### A. Thermal Performance
The "C3" in the part number indicates a specific thermal profile. This heat sink is designed for **straight fin** airflow, which is ideal for systems with a clear, directional path for air to move across the component. The thermal resistance decreases significantly as airflow (LFM - Linear Feet per Minute) increases:
* **Low Airflow (1.0 m/s):** High resistance.
* **High Airflow (3.5 m/s):** Resistance drops to approximately 1.45 °C/W.
#### B. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, the **ATS-04D-72-C3-R0** uses a mechanical attachment system consisting of:
* **Push-pins:** Plastic or brass pins that lock into pre-drilled holes in the PCB.
* **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the electronic component (CPU, GPU, or FPGA), maximizing heat transfer.
#### C. Material and Finish
* **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodize:** This is not just for aesthetics; the anodized coating increases surface emissivity, slightly improving radiative cooling and providing corrosion resistance.
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### 3. Applications
This specific heat sink is typically used for cooling:
1. **Application Specific Integrated Circuits (ASICs)**
2. **Field Programmable Gate Arrays (FPGAs)**
3. **Microprocessors** in telecommunications or industrial networking equipment.
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- ⤷
What are the PCB hole diameter requirements for the pushPIN system?
- ⤷ How does 'Straight Fin' design compare to 'Cross-Cut' designs for thermal efficiency?
- ⤷ Is a Thermal Interface Material (TIM) pre-applied to this part number?