The **ATS-04D-80-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Push Pin" series, designed primarily for cooling electronic components like CPUs, GPUs, and high-power ICs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Parameter | Specification | Details | | :--- | :--- | :--- | | **Component Type** | Heat Sink | Passive cooling component | | **Material** | Aluminum | Blue Anodized finish | | **Dimensions** | 30mm x 30mm | Length x Width | | **Height** | 25mm | Vertical clearance | | **Attachment** | Push Pin (Plastic) | 2-pin attachment method | | **Spring Type** | Brass | Compression spring for constant pressure | | **Thermal Interface** | T766 | Pre-applied phase change material | | **Fin Style** | Straight | Vertical fins for optimized airflow | --- ### 2. Electronic Thermal Performance The efficiency of this part is measured by its **Thermal Resistance**, which determines how effectively it moves heat away from the silicon die. * **Airflow @ 100 LFM (Linear Feet per Minute):** ~7.05 °C/W * **Airflow @ 200 LFM:** ~4.51 °C/W * **Airflow @ 500 LFM:** ~3.31 °C/W *Note: Lower °C/W values indicate better cooling performance as airflow increases.* --- ### 3. Key Electronic Features * **Pre-Applied Thermal Interface Material (TIM):** It comes with a T766 pad, which eliminates the need for manual thermal paste application, ensuring uniform heat transfer across the electronic package. * **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from oxidation and provides a slight increase in surface emissivity. * **Push Pin Mechanism:** This design provides a specific, calibrated "clamping force" (calculated in grams or Newtons). This is critical for delicate electronic components to ensure a secure fit without cracking the PCB or the chip. --- ### 4. Typical Applications This specific heat sink is used in hardware where space is limited but heat density is high: 1. **Network Switches/Routers:** Cooling ASICs or high-speed processors. 2. **Embedded Systems:** Industrial PCs where fan-less cooling or high-reliability cooling is required. 3. **Power Supplies:** Heat dissipation for MOSFETs or Voltage Regulators.