The **ATS-04D-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Copper (Optional Base/Plate) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~10.79°C/W (Unducted) | | **Finish** | Blue Anodized | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this part utilizes a spring-loaded push-pin mechanism. * **Benefits:** Provides consistent pressure across the interface and allows for easy installation/removal. * **Springs:** Usually made of stainless steel or brass to maintain tension over time. #### B. Heat Sink Geometry * **Straight Fin Design:** The vertical fins are optimized for both natural convection and forced air (fan) cooling. * **Height (25mm):** The relatively tall profile increases the surface area for heat exchange but requires sufficient clearance within the enclosure. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with a pre-applied high-performance thermal interface material. This fills microscopic air gaps between the heat sink and the chip to improve heat transfer. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: * **ATS:** Manufacturer prefix. * **04:** Series/Type. * **D:** Attachment type (Push-Pin). * **82:** Specific thermal/physical footprint code. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or Thermal Interface Material specification. --- ### 4. Application Use Cases * **Embedded Systems:** Cooling microcontrollers or FPGAs. * **Networking:** Keeping routers and switches cool under heavy data loads. * **Power Electronics:** Cooling voltage regulators or power modules.