ATS-04D-84-C2-R0
AI

The **ATS-04D-84-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** line, designed for efficient heat dissipation in electronic components such as CPUs, GPUs, and high-power chipsets.
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### 1. Technical Specifications
The part number provides specific data regarding its dimensions, thermal resistance, and mounting style.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance (Flowing)** | 1.10 °C/W @ 500 LFM |
| **Thermal Resistance (Static)** | 7.00 °C/W @ Ducted flow |
| **Dimensions (L x W x H)** | 30mm x 30mm x 25mm |
| **Mounting Type** | pushPIN™ (Spring-loaded) |
| **Pitch** | 35mm x 35mm |
| **Attachment Style** | Compression Springs / Plastic Push Pins |
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### 2. Design Characteristics
This heat sink utilizes a **Cross-Cut** (fine pitch) design to maximize surface area within a small footprint.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-conductivity thermal grease.
* **Spring Mechanism:** It uses a brass spring and plastic pin assembly. This ensures consistent pressure across the component, improving thermal transfer efficiency.
* **Airflow Optimization:** The fin structure is designed for high-velocity airflow environments (server racks, high-speed fans), though it maintains decent performance in passive environments.
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### 3. Electronic Application
The ATS-04D-84-C2-R0 is commonly used for the following electronic components:
1. **BGA Packages:** Ideal for Ball Grid Array components that generate significant heat (5W - 15W range).
2. **Embedded Systems:** Used on industrial PC motherboards where space is restricted but cooling is critical.
3. **Network Hardware:** Found on high-speed routers and switches where constant airflow is present.
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### 4. Cross-Reference & Alternatives
If this specific part is unavailable, engineers often look for the following variations:
| Part Number | Difference |
| :--- | :--- |
| **ATS-04D-84-C1-R0** | Different Thermal Interface Material (usually Phase Change) |
| **ATS-04D-84-C3-R0** | Variations in fin height or anodization color |
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- ⤷What is the difference between T766 and other thermal interface materials used by ATS?
- ⤷ How do I calculate the required airflow (LFM) for this heat sink?
- ⤷ Is there a version of this heat sink available with copper instead of aluminum?