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  • ATS-04D-84-C2-R0

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    The **ATS-04D-84-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** line, designed for efficient heat dissipation in electronic components such as CPUs, GPUs, and high-power chipsets. --- ### 1. Technical Specifications The part number provides specific data regarding its dimensions, thermal resistance, and mounting style. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 1.10 °C/W @ 500 LFM | | **Thermal Resistance (Static)** | 7.00 °C/W @ Ducted flow | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Mounting Type** | pushPIN™ (Spring-loaded) | | **Pitch** | 35mm x 35mm | | **Attachment Style** | Compression Springs / Plastic Push Pins | --- ### 2. Design Characteristics This heat sink utilizes a **Cross-Cut** (fine pitch) design to maximize surface area within a small footprint. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-conductivity thermal grease. * **Spring Mechanism:** It uses a brass spring and plastic pin assembly. This ensures consistent pressure across the component, improving thermal transfer efficiency. * **Airflow Optimization:** The fin structure is designed for high-velocity airflow environments (server racks, high-speed fans), though it maintains decent performance in passive environments. --- ### 3. Electronic Application The ATS-04D-84-C2-R0 is commonly used for the following electronic components: 1. **BGA Packages:** Ideal for Ball Grid Array components that generate significant heat (5W - 15W range). 2. **Embedded Systems:** Used on industrial PC motherboards where space is restricted but cooling is critical. 3. **Network Hardware:** Found on high-speed routers and switches where constant airflow is present. --- ### 4. Cross-Reference & Alternatives If this specific part is unavailable, engineers often look for the following variations: | Part Number | Difference | | :--- | :--- | | **ATS-04D-84-C1-R0** | Different Thermal Interface Material (usually Phase Change) | | **ATS-04D-84-C3-R0** | Variations in fin height or anodization color | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between T766 and other thermal interface materials used by ATS?
    • ⤷ How do I calculate the required airflow (LFM) for this heat sink?
    • ⤷ Is there a version of this heat sink available with copper instead of aluminum?