The **ATS-04D-91-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is part of the **blue-ANODIZED** series, specifically designed for cooling electronic components like CPUs, GPUs, or power modules in constrained spaces. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 22.07 °C/W @ 100 LFM | | **Thermal Interface Material** | T412 (Phase Change) | | **Fin Configuration** | Fine Pitch (Straight) | --- ### 2. Key Electronic Components & Design Features #### A. The pushPIN™ Attachment System This part uses a specialized **pushPIN™** mechanism. Unlike adhesive-based heat sinks, this uses a brass or plastic pin with a high-tension spring. * **Mechanical Stability:** It provides a consistent "clamping force" on the electronic chip, ensuring optimal contact. * **Reusability:** It can be removed and reinstalled without damaging the PCB or the component. #### B. Thermal Interface Material (T412) The bottom of the heat sink comes pre-applied with **T412**. * **Purpose:** It fills the microscopic air gaps between the heat sink and the electronic component (die). * **Efficiency:** It is a high-performance phase-change material that offers low thermal impedance. #### C. Fin Geometry (Straight-Fin) The "91" in the part number refers to the specific fin design. * **Airflow:** This design is optimized for environments where there is a consistent directional airflow (ducted or fan-assisted). * **Surface Area:** The fine-pitch fins maximize the surface area for heat dissipation while maintaining a low 10mm height profile. --- ### 3. Common Applications This heat sink is typically found in the following electronic systems: 1. **Network Switches & Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** For industrial PCs where vertical space is limited. 3. **Power Electronics:** Dissipating heat from voltage regulators or small MOSFET arrays.