ATS-04D-94-C2-R0
AI

The **ATS-04D-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series designed for cooling integrated circuits (ICs) and other PCB components.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm |
| **Fin Type** | Straight Fin |
| **Thermal Resistance (Unducted)** | 4.49 °C/W @ 100 LFM |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design and Engineering Features
### A. Fin Geometry (Straight Fin)
The "Straight Fin" design is optimized for environments where there is a consistent, directional airflow. This design allows for a low pressure drop while maximizing the surface area available for heat dissipation from the component to the ambient air.
### B. Attachment Mechanism: pushPIN™
Unlike adhesive-based heat sinks, this part uses a mechanical attachment system:
* **Compression Springs:** Ensure even pressure across the surface of the processor, preventing "hot spots."
* **Plastic/Brass Push Pins:** Secure the heat sink through pre-drilled holes in the PCB, providing a robust connection that survives high-vibration environments.
### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base. This is a high-performance thermal grease/pad that fills microscopic air gaps between the heat sink and the chip, significantly lowering the contact resistance.
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### 3. Application Use Cases
This component is typically used in industrial and telecommunications hardware, such as:
1. **Network Switches/Routers:** Cooling ASICs or FPGAs.
2. **Embedded Systems:** High-heat generating CPUs in compact enclosures.
3. **Power Supplies:** Cooling MOSFETs or power regulators.
- ⤷
What are the PCB hole diameter requirements for the pushPIN attachment?
- ⤷ How does the thermal resistance change at higher airflow (e.g.
- ⤷ 500 LFM)?
- ⤷ Are there alternative fin patterns for this footprint
- ⤷ such as cross-cut or pin-fin?