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  • ATS-04D-94-C2-R0

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    The **ATS-04D-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series designed for cooling integrated circuits (ICs) and other PCB components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Fin Type** | Straight Fin | | **Thermal Resistance (Unducted)** | 4.49 °C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features ### A. Fin Geometry (Straight Fin) The "Straight Fin" design is optimized for environments where there is a consistent, directional airflow. This design allows for a low pressure drop while maximizing the surface area available for heat dissipation from the component to the ambient air. ### B. Attachment Mechanism: pushPIN™ Unlike adhesive-based heat sinks, this part uses a mechanical attachment system: * **Compression Springs:** Ensure even pressure across the surface of the processor, preventing "hot spots." * **Plastic/Brass Push Pins:** Secure the heat sink through pre-drilled holes in the PCB, providing a robust connection that survives high-vibration environments. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance thermal grease/pad that fills microscopic air gaps between the heat sink and the chip, significantly lowering the contact resistance. --- ### 3. Application Use Cases This component is typically used in industrial and telecommunications hardware, such as: 1. **Network Switches/Routers:** Cooling ASICs or FPGAs. 2. **Embedded Systems:** High-heat generating CPUs in compact enclosures. 3. **Power Supplies:** Cooling MOSFETs or power regulators.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the pushPIN attachment?
    • ⤷ How does the thermal resistance change at higher airflow (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Are there alternative fin patterns for this footprint
    • ⤷ such as cross-cut or pin-fin?