The **ATS-04E-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" series designed for cooling processors and other integrated circuits. --- ### 1. Technical Specifications Below are the key physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 30mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Interface Material** | T766 (High Performance Phase Change) | | **Thermal Resistance** | 6.77 °C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Electronic/Thermal Components breakdown #### A. The Heat Sink Body The core is made of **AL6063 aluminum**, chosen for its balance of high thermal conductivity and light weight. The 30mm height provides a significant surface area for heat dissipation into the surrounding air via natural or forced convection. #### B. The Push-Pin Attachment Instead of using adhesive tape or soldering, this part uses a **mechanical push-pin system** with a compression spring. * **Purpose:** Ensures consistent pressure between the heat sink and the electronic component (CPU/GPU/FPGA). * **Benefit:** This prevents air gaps and compensates for thermal expansion/contraction during electronic operation. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 phase-change material**. * **Function:** It fills the microscopic air gaps between the chip surface and the heat sink base. * **Behavior:** When the electronic part heats up, the T766 softens/melts to provide maximum thermal contact. --- ### 3. Typical Applications This specific thermal solution is used in various electronic systems where heat dissipation is critical for component longevity: * **Networking Hardware:** High-speed routers and switches. * **Industrial PCs:** Embedded systems requiring passive or active cooling. * **Power Supplies:** Cooling voltage regulators and power MOSFETs. * **FPGA & ASICs:** Protecting custom logic chips from thermal throttling. --- ### 4. Thermal Performance Comparison The efficiency of the heat sink depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 12.63 | | **200** | 6.77 | | **400** | 4.24 | | **600** | 3.22 |