The **ATS-04E-72-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "push pin" series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount chips. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Heat Sink Type** | Straight Fin | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 5.11°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Components & Materials #### A. The Heat Sink Body The body is constructed from **Aluminum**, which is chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity, aiding in heat radiation. #### B. Attachment Mechanism (Push Pin & Spring) The "04E" designation refers to the attachment kit. It uses a **plastic push pin** combined with a **brass or steel spring**. This system provides: * **Constant Pressure:** Ensures the heat sink remains firmly against the component. * **Ease of Assembly:** Can be installed manually without complex tools. * **Secure Fit:** Designed to fit specific PCB hole patterns (typically 3.0mm diameter holes). #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Purpose:** It fills microscopic air gaps between the heat sink and the electronic chip. * **Benefit:** This reduces thermal resistance significantly compared to "dry" mounting. --- ### 3. Application & Performance The ATS-04E-72-C2-R0 is engineered for **forced air cooling** environments. Its straight fin design allows air to flow through the channels with minimal resistance. * **Cooling Efficiency:** As airflow (LFM - Linear Feet per Minute) increases, the thermal resistance drops, allowing the part to dissipate more Watts of heat. * **Target Components:** High-speed processors, FPGAs, and power-dense telecommunication equipment. ---