The **ATS-04E-76-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Thermal Resistance** | 27.33°C/W (Natural Convection) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Style** | Straight Fin | --- ### 2. Core Electronic/Thermal Features #### A. Attachment Mechanism (Push-Pin) The "04E" in the part number signifies the specific push-pin and spring assembly. * **Purpose:** Provides a consistent, high-pressure attachment to the PCB. * **Benefit:** This ensures maximum contact between the heat sink base and the electronic component, reducing interfacial thermal resistance. #### B. Thermal Interface Material (T766) This part comes with **T766** pre-applied to the base. * **Role:** Fills microscopic air gaps between the heat sink and the chip. * **Electronic Safety:** It is typically non-electrically conductive, preventing shorts on the surface of the component. #### C. Fin Design and Airflow The straight-fin design is optimized for specific airflow directions. * **High Performance:** In forced air systems (with a fan), the thermal resistance can drop significantly (e.g., down to ~5.0°C/W at 400 LFM), allowing for much higher power dissipation. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **04** | Attachment Series (Push-pin type) | | **E** | Spring Type/Pressure Rating | | **76** | Part-specific Identifier (Dimensions/Fin Count) | | **C2** | Color/Finish (C2 usually denotes Blue Anodized) | | **R0** | RoHS Compliance Status | --- ### 4. Application Use Cases * **Embedded Systems:** Cooling small-form-factor processors. * **Networking Gear:** Cooling chips inside routers and switches where vertical space is limited (10mm height). * **Power Supplies:** Managing heat for voltage regulators or MOSFETs. ---