The **ATS-04E-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling element directly to a PCB. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Fin Style** | Straight | | **Fin Pattern** | Fine-Pitch (High density) | | **Thermal Resistance** | 2.63°C/W (@ 100 LFM) | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body * **Material:** Constructed from high-grade aluminum for optimal thermal conductivity. * **Geometry:** It features a square footprint (25mm) with a relatively tall profile (30mm), making it suitable for compact spaces that allow for vertical clearance. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or complex brackets, this part uses a spring-loaded push-pin mechanism: * **Push-Pins:** Usually made of brass or plastic, designed to click into pre-drilled holes in the PCB. * **Compression Springs:** These ensure consistent pressure (clamping force) between the heat sink and the electronic component (CPU, GPU, or FPGA), which is vital for efficient heat transfer. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the heat sink comes with a **pre-applied Thermal Interface Material**. This is a phase-change material or thermal pad located on the base of the heat sink to fill microscopic air gaps between the component and the metal. --- ### 3. Application Use-Cases This specific part is generally used for cooling medium-power semiconductors in industrial or networking environments: 1. **Networking:** Cooling small switches, routers, or interface chips. 2. **Embedded Systems:** High-speed processors in industrial PCs. 3. **Power Electronics:** Cooling MOSFETs or voltage regulators that are generating concentrated heat. --- ### 4. Thermal Performance Comparison Thermal resistance indicates how effectively the device moves heat away from the component. A lower value is better. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 2.63 | | 300 | 1.5 | 1.35 | | 500 | 2.5 | 1.05 |