The **ATS-04E-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.62°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Design Details * **Fin Pitch:** This model uses a **Super Fine Pitch** design. This increases the surface area significantly, allowing for better cooling in airflow-restricted environments. * **Base:** The base is flat and designed to sit directly on the semiconductor package, often requiring a Thermal Interface Material (TIM). * **Dimensions:** * **Length:** 30mm * **Width:** 30mm * **Height:** 20mm (Dimension 'C' in the part number) --- ### 3. Attachment Mechanism: pushPIN™ The "04E" in the part number indicates the specific mounting configuration. This system uses a spring-loaded push-pin to ensure: 1. **Uniform Pressure:** Prevents damage to the delicate electronic die. 2. **Reliability:** Maintains a consistent connection even under high-vibration conditions. 3. **Ease of Assembly:** Pre-drilled holes in the PCB allow for quick, tool-free installation. --- ### 4. Thermal Performance The efficiency of the heat sink is measured by its **Thermal Resistance**. Lower values indicate better heat dissipation. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 3.00 | | 200 | 1.0 | 1.62 | | 400 | 2.0 | 1.10 | | 600 | 3.0 | 0.90 | --- ### 5. Application Use-Cases * **Telecommunications:** Cooling high-speed network switches. * **Industrial PCs:** Compact form-factor computers that generate significant heat. * **Power Supplies:** Regulating the temperature of MOSFETs or voltage regulators. * **Embedded Systems:** Protecting sensitive microcontrollers from thermal throttling. ---