The **ATS-04E-85-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for electronic packaging, typically used to dissipate heat from integrated circuits (ICs), CPUs, or GPUs. --- ## 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 23.98 °C/W (at 100 LFM) | --- ## 2. Component Breakdown ### A. Material and Design * **Aluminum Body:** Chosen for its excellent thermal conductivity and lightweight properties. * **Straight Fin Design:** This model features a straight fin geometry, which is ideal for systems where there is a consistent, unidirectional airflow. * **Blue Anodized Finish:** The surface treatment improves corrosion resistance and provides a slight increase in emissivity for radiative cooling. ### B. Mounting Mechanism (pushPIN™) The "85-C2-R0" designation refers to the mounting kit: 1. **Push-Pins:** Plastic pins that snap into pre-drilled holes in the PCB. 2. **Compression Springs:** These ensure a consistent and precise pressure (preload) between the heat sink and the electronic component, which is critical for maximizing thermal transfer. ### C. Thermal Interface Material (TIM) * The part usually comes pre-applied with **ATS-PPS-04**, a high-performance thermal phase-change material or grease, ensuring there are no air gaps between the heat source and the sink. --- ## 3. Performance Summary The efficiency of the **ATS-04E-85-C2-R0** is highly dependent on the Airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 23.98 | | 300 (1.5 m/s) | 10.85 | | 500 (2.5 m/s) | 7.70 | --- ## 4. Typical Applications * **Telecommunications:** Used on high-speed line cards. * **Embedded Systems:** Cooling for ARM-based processors or FPGAs. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators in compact enclosures.