The **ATS-04F-02-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-04F-02-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Fin Type** | Fine Pitch (High Density) | | **Thermal Resistance** | ~18.3°C/W (at 100 LFM) to ~2.1°C/W (at 800 LFM) | | **Dimensions (L x W x H)** | 40.0mm x 40.0mm x 12.7mm | --- ### 2. Physical Design and Construction #### Thermal Interface Material (TIM) The "C2" suffix in the part number indicates that the heat sink comes pre-applied with **T766 Phase Change Material**. This material acts as a thermal bridge between the electronic component (CPU, FPGA, or GPU) and the heat sink, filling microscopic air gaps to improve heat transfer. #### Heat Sink Geometry * **Fine Pitch Fins:** The vertical fins are spaced closely together to maximize surface area. This design is optimized for environments with **forced air cooling** (fans). * **Aluminum Body:** Provides a lightweight solution with high thermal conductivity. The blue anodized finish increases surface emissivity and protects the metal from corrosion. --- ### 3. Attachment Mechanism: Push-Pin & Spring Unlike adhesive-based heat sinks, the **ATS-04F-02-C2-R0** uses a mechanical fastening system: * **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes in the PCB. * **Springs:** Compression springs ensure constant, uniform pressure across the component. This prevents the heat sink from shifting during vibration or thermal expansion. --- ### 4. Typical Applications This part is commonly used to cool integrated circuits that generate significant heat in restricted spaces: * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Regulating temperature for voltage converters. * **Telecommunications:** Cooling FPGA and ASIC chips.