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  • ATS-04F-03-C3-R0

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    The **ATS-04F-03-C3-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power MOSFETs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.97°C/W (Unducted Flow @ 200 LFM) | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T412 (Phase change or grease pre-applied) | --- ### 2. Design and Engineering Components #### A. The Fin Geometry The "03" in the part number refers to a specific fin configuration. Straight fins are ideal for environments where there is a consistent, unidirectional airflow. The aluminum construction provides a balance between weight and thermal conductivity. #### B. The Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent thermal tape, this part uses a mechanical fastening system: * **Plastic Push-Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** These ensure that the heat sink applies a consistent, calibrated pressure onto the electronic chip, which is critical for maximizing heat transfer. #### C. Thermal Interface Material (TIM) The **C3** designation in the part number indicates the type of TIM pre-applied to the base. In this case, it usually refers to **T412**, a high-performance material that fills microscopic air gaps between the component and the heat sink. --- ### 3. Applications This part is commonly used in industrial and consumer electronics where reliable cooling is required for: 1. **Network Switches and Routers:** Cooling internal processors. 2. **Power Supplies:** Managing heat from voltage regulators. 3. **Embedded Systems:** Industrial PCs where vibration resistance is needed (the push-pins keep the sink secure). --- ### 4. Part Number Breakdown (Nomenclature) `ATS - 04 F - 03 - C3 - R0` * **ATS:** Advanced Thermal Solutions (Manufacturer). * **04:** Series/Family. * **F:** Fin height/style code. * **03:** Specific fin geometry and spacing. * **C3:** Blue Anodized finish with T412 Thermal Interface Material. * **R0:** RoHS compliant version.
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required airflow (LFM) for this heat sink?
    • ⤷ What are the PCB hole diameter requirements for the push-pin installation?
    • ⤷ Is there a copper version of this heat sink for higher thermal conductivity?