The **ATS-04F-05-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (typically blue anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | ~26.0 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Type** | Fine Pitch (Straight or Cross-cut depending on variant) | | **TIM (Interface Material)** | T412 (High performance thermal tape/grease) | --- ### 2. Key Components & Design Electronic heatsinks like the ATS-04F-05-C3-R0 are composed of several critical sub-parts: * **Base Plate:** The flat bottom surface that makes direct contact with the electronic chip. It is precision-machined to ensure maximum surface contact. * **Fins:** These vertical structures increase the total surface area, allowing heat to transfer from the metal to the surrounding air more efficiently. * **Push-Pin Fasteners:** A spring-loaded mechanism that provides a consistent downward force (pressure), ensuring the heatsink stays firmly attached to the PCB. * **Thermal Interface Material (TIM):** Pre-applied to the bottom, this fills microscopic air gaps between the chip and the heatsink to improve heat conductivity. --- ### 3. Electronic Application This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling signal processors in routers or switches. 2. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Cooling industrial PCs where space is limited but vertical airflow is available. --- ### 4. Thermal Performance Overview The "C3" in the part number indicates a specific thermal configuration. Below is the estimated performance based on airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 26.36 | | 200 (1.0 m/s) | 11.51 | | 300 (1.5 m/s) | 8.41 | | 400 (2.0 m/s) | 6.97 |