The **ATS-04F-06-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance (Unducted)** | 20.27 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 4.69 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **04**: General series/style identification. * **F**: Fin pitch/pattern (Fine pitch for higher surface area). * **06**: Specific size or internal designator. * **C3**: Material/Finish code (typically denotes Aluminum with Blue Anodize). * **R0**: Revision or packaging indicator. --- ### 3. Key Component Features #### A. Fin Design The heat sink features a **Square-Fin** or **Cross-Cut** pattern. This design allows for multidirectional airflow, meaning it can dissipate heat effectively regardless of the orientation of the cooling fans inside the electronic enclosure. #### B. Push-Pin Mounting System Instead of using messy thermal adhesives or complex screws, this part uses a **Push-Pin** mechanism: * **Spring-loaded:** Ensures constant pressure on the electronic component (IC), optimizing thermal transfer. * **Ease of Install:** No tools are typically required for installation; the pins snap into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "R0" variant often comes with **pre-applied Thermal Interface Material** on the base. This ensures a low thermal resistance path between the heat source (the chip) and the aluminum heat sink. --- ### 4. Typical Applications This component is used in environments where heat dissipation is critical for electronic longevity: 1. **Networking Equipment:** Routers and switches. 2. **Power Supplies:** Cooling MOSFETs or power ICs. 3. **Industrial PCs:** Compact computing modules. 4. **Embedded Systems:** High-speed processors in automated machinery. ---