The **ATS-04F-07-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling high-heat-generating electronic components like BGA (Ball Grid Array) chips, CPUs, and GPUs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Material** | Aluminum | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance (Unducted)** | 16.97 °C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | Pre-applied (ATS-51 Blue) | | **Finish** | Blue Anodized | --- ### 2. Design and Component Breakdown #### A. The Fin Geometry The "07" in the part number refers to a specific **Fine-Pitch** design. The cross-cut pattern allows for air to flow from multiple directions (omnidirectional), making it highly effective in compact enclosures where airflow might be turbulent or unpredictable. #### B. Push-Pin Attachment System This part features the **pushPIN™** system, which consists of: * **Brass/Plastic Pins:** Used to secure the heat sink to the PCB. * **Compression Springs:** These provide a precise "Force-on-Chip" to ensure uniform contact between the heat sink and the electronic component, preventing mechanical stress on the solder balls. #### C. Thermal Interface Material (TIM) The unit comes with **ATS-51 Blue** pre-applied to the base. This is a high-performance thermal pad/grease that fills microscopic air gaps between the chip and the aluminum base, significantly reducing thermal resistance. --- ### 3. Application Use-Cases Electronic engineers select the ATS-04F-07-C1-R0 for the following scenarios: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Where low-profile (12.7mm height) cooling is required. * **Power Supplies:** Cooling MOSFETs or power ICs. * **Embedded Systems:** Providing reliable cooling in fan-less or forced-air environments. ---