ATS-04F-102-C2-R0
AI

The **ATS-04F-102-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** family, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat integrated circuits.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Spring Type** | ATS-PPS-04 |
| **Thermal Interface Material** | T766 (Pre-applied) |
| **Airflow Direction** | Fine Pitch (Square Fin) |
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### 2. Key Components and Features
#### A. The Heat Sink Body
The body is constructed from **AL6063 aluminum**, which offers a balance between thermal conductivity and structural integrity. The "Fine Pitch" design increases the surface area, allowing for better heat dissipation in forced-air environments (fan-cooled systems).
#### B. The pushPIN™ Attachment System
This part uses a proprietary attachment mechanism consisting of:
* **Plastic Push Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board).
* **Compression Springs:** They ensure a consistent, pre-measured pressure (7.0 - 10.0 PSI) is applied to the component, maximizing thermal transfer without damaging the chip.
#### C. Thermal Interface Material (TIM)
The unit comes with **T766 thermal grease** pre-applied to the base. This material fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance.
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### 3. Thermal Performance (Typical)
The efficiency of the ATS-04F-102-C2-R0 depends on the air velocity (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 (0.5 m/s)** | 5.24 |
| **300 (1.5 m/s)** | 1.97 |
| **500 (2.5 m/s)** | 1.15 |
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### 4. Summary of Design Benefits
1. **Uniform Pressure:** The spring-loaded pins prevent the heat sink from tilting, ensuring the entire surface of the chip is cooled evenly.
2. **Ease of Assembly:** The push-pin design allows for tool-less installation, reducing manufacturing time.
3. **Corrosion Resistance:** The blue anodized finish protects the aluminum from oxidation and provides a professional aesthetic.
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What are the PCB hole requirements for the ATS-PPS-04 spring system?
- ⤷ How does the T766 thermal material compare to standard thermal paste?
- ⤷ Are there specific fan configurations recommended for this heat sink size?