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  • ATS-04F-102-C2-R0

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    The **ATS-04F-102-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** family, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Spring Type** | ATS-PPS-04 | | **Thermal Interface Material** | T766 (Pre-applied) | | **Airflow Direction** | Fine Pitch (Square Fin) | --- ### 2. Key Components and Features #### A. The Heat Sink Body The body is constructed from **AL6063 aluminum**, which offers a balance between thermal conductivity and structural integrity. The "Fine Pitch" design increases the surface area, allowing for better heat dissipation in forced-air environments (fan-cooled systems). #### B. The pushPIN™ Attachment System This part uses a proprietary attachment mechanism consisting of: * **Plastic Push Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board). * **Compression Springs:** They ensure a consistent, pre-measured pressure (7.0 - 10.0 PSI) is applied to the component, maximizing thermal transfer without damaging the chip. #### C. Thermal Interface Material (TIM) The unit comes with **T766 thermal grease** pre-applied to the base. This material fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. --- ### 3. Thermal Performance (Typical) The efficiency of the ATS-04F-102-C2-R0 depends on the air velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 5.24 | | **300 (1.5 m/s)** | 1.97 | | **500 (2.5 m/s)** | 1.15 | --- ### 4. Summary of Design Benefits 1. **Uniform Pressure:** The spring-loaded pins prevent the heat sink from tilting, ensuring the entire surface of the chip is cooled evenly. 2. **Ease of Assembly:** The push-pin design allows for tool-less installation, reducing manufacturing time. 3. **Corrosion Resistance:** The blue anodized finish protects the aluminum from oxidation and provides a professional aesthetic.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the ATS-PPS-04 spring system?
    • ⤷ How does the T766 thermal material compare to standard thermal paste?
    • ⤷ Are there specific fan configurations recommended for this heat sink size?