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  • ATS-04F-110-C2-R1

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    The **ATS-04F-110-C2-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.69°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Fin Style** | XC-CUT (Cross-Cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. XC-CUT Fin Design The "XC-CUT" or cross-cut fin pattern increases the surface area and allows for **multi-directional airflow**. Unlike straight-fin heat sinks that require air to move in one specific direction, this design is more efficient in systems where air turbulence or changing flow directions occur. #### B. pushPIN™ Attachment The "R1" suffix typically denotes the attachment system. The pushPIN™ mechanism consists of: * **Compression Springs:** Provide precise pressure to ensure optimal contact with the electronic component. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material or high-performance thermal grease that fills microscopic air gaps between the heat sink and the chip, significantly lowering thermal resistance. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the ATS coding system helps identify the part's capabilities: | Code Segment | Meaning | | :--- | :--- | | **ATS-04** | Series/Internal family identifier | | **F** | Fin pitch/density indicator | | **110** | Specific dimensions/profile code | | **C2** | Material/Finish code (Blue Anodized Aluminum) | | **R1** | Revision or Packaging/Attachment variant | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecommunications:** Network switches and routers. * **Power Electronics:** Voltage regulators and high-speed MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the optimal 2.69°C/W thermal resistance?
    • ⤷ Are there alternative attachment methods if my PCB does not have pushPIN holes?
    • ⤷ How does the T766 TIM compare to standard thermal paste in long-term reliability?