ATS-04F-110-C2-R1
AI

The **ATS-04F-110-C2-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part number:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 2.69°C/W (at 1.0 m/s airflow) |
| **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm |
| **Fin Style** | XC-CUT (Cross-Cut) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Component Features
#### A. XC-CUT Fin Design
The "XC-CUT" or cross-cut fin pattern increases the surface area and allows for **multi-directional airflow**. Unlike straight-fin heat sinks that require air to move in one specific direction, this design is more efficient in systems where air turbulence or changing flow directions occur.
#### B. pushPIN™ Attachment
The "R1" suffix typically denotes the attachment system. The pushPIN™ mechanism consists of:
* **Compression Springs:** Provide precise pressure to ensure optimal contact with the electronic component.
* **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base. This is a phase-change material or high-performance thermal grease that fills microscopic air gaps between the heat sink and the chip, significantly lowering thermal resistance.
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### 3. Part Number Breakdown (Nomenclature)
Understanding the ATS coding system helps identify the part's capabilities:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS-04** | Series/Internal family identifier |
| **F** | Fin pitch/density indicator |
| **110** | Specific dimensions/profile code |
| **C2** | Material/Finish code (Blue Anodized Aluminum) |
| **R1** | Revision or Packaging/Attachment variant |
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### 4. Typical Applications
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Telecommunications:** Network switches and routers.
* **Power Electronics:** Voltage regulators and high-speed MOSFETs.
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What are the airflow requirements to achieve the optimal 2.69°C/W thermal resistance?
- ⤷ Are there alternative attachment methods if my PCB does not have pushPIN holes?
- ⤷ How does the T766 TIM compare to standard thermal paste in long-term reliability?